Wafers and Substrates

Wafers and substrates serve as the fundamental platforms for the fabrication of modern electronic and photonic devices. These base materials provide the structural and electrical foundation upon which semiconductors, MEMS, LEDs, and optical components are built. With continuous advances in technology, the demand for high-purity, defect-free wafers and substrates with precise dimensional and crystallographic specifications has grown exponentially. Our company is committed to supplying a broad spectrum of wafer and substrate materials that meet the stringent requirements of both research institutions and large-scale commercial manufacturers.
Wafers and Substrates - Tinsan Materials
Whether the need is for cutting-edge laser components, next-generation integrated circuits, or advanced RF modules, we offer tailor-made solutions with exceptional quality and performance. Our deep industry knowledge and flexible customization capabilities make us a trusted partner in enabling innovation across multiple high-tech sectors.

Material Portfolio

Tinsan Materials offers an extensive and diversified range of wafer and substrate materials suitable for a variety of applications in microelectronics, optoelectronics, and advanced photonics:
Silicon (Si): Available in various doping levels and types (CZ, FZ), silicon is the cornerstone of the semiconductor industry, widely used in integrated circuits, solar cells, and MEMS devices. Sapphire (Al₂O₃): A robust and optically transparent material ideal for LEDs, optical windows, and substrates for GaN epitaxy. Known for high hardness and thermal stability. Gallium Arsenide (GaAs): Used in high-speed and optoelectronic applications such as LEDs, laser diodes, and RF amplifiers. Offers superior electron mobility compared to silicon. Indium Phosphide (InP): Favored in photonics and high-frequency communication devices due to its excellent electron velocity and optical properties. Silicon Carbide (SiC): A wide bandgap material ideal for high-temperature, high-voltage, and high-power electronic applications. Used in power electronics and electric vehicles. Quartz & Fused Silica: Transparent from UV to IR with high thermal and chemical resistance. Preferred for optical applications and semiconductor photomasks. Glass Substrates: Including borosilicate, aluminosilicate, and soda-lime glass—used in display technologies, sensor packaging, and photonic circuits. Germanium (Ge): A high-refractive-index material used in IR optics, thermographic cameras, and semiconductor research. Lithium Niobate (LiNbO₃) & Lithium Tantalate (LiTaO₃): Piezoelectric and electro-optic crystals ideal for modulators, filters, and SAW/BAW devices.
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Wafer Specifications

We provide wafers in a wide range of specifications to suit diverse application needs:
Diameters: From 1 inch (25.4 mm) to 8 inches (200 mm), with the ability to customize larger or non-standard sizes. Crystal Orientation: Offered in <100>, <111>, <110>, or custom orientations based on device fabrication requirements. Doping Types: P-type (e.g., Boron) or N-type (e.g., Phosphorus, Antimony, Arsenic), or intrinsic/undoped options. Surface Finishes: Single-side polished (SSP), double-side polished (DSP), ground, lapped, etched, or mirror-finished. Thickness Range: From ultra-thin (<100 µm) to thick (>1 mm), with tight tolerances typically within ±5 µm or better. Flatness Control: Total Thickness Variation (TTV), bow, and warp maintained per SEMI standards or stricter. Other Attributes: Edge profile (notched or flat), laser marks, and oxide/nitride coatings available on request.

Substrate Customization

Tinsan Materials offers a range of customization options to adapt substrates to your specific device or process needs:
Shapes and Dimensions: Circular, square, or rectangular substrates with precise machining to custom dimensions. Edge Processing: Rounding, chamfering, or beveling to reduce handling damage or enhance process compatibility. Surface Conditioning: From high-polish mirror surfaces to roughened or patterned textures for improved adhesion. Slotting and Dicing: Mechanical or laser dicing into smaller dies or slotted wafers for MEMS and photonic packaging. Coatings and Layers: Thermal oxides, silicon nitrides, or customer-specified coatings applied under controlled environments.
wafers and substrates

Applications

Our wafers and substrates are integral to the following key industries and applications:
Semiconductors: Base substrates for the production of integrated circuits, transistors, and logic devices. MEMS and Sensors: Structural platforms for accelerometers, pressure sensors, gyroscopes, and biosensors. Optoelectronics: Substrates for laser diodes, LEDs, and photodetectors, particularly using sapphire, GaAs, and InP. Photonics: Used in waveguides, photonic integrated circuits, and quantum computing applications. LED Manufacturing: Sapphire substrates for GaN epitaxial growth in high-brightness blue and UV LEDs. RF and Microwave Devices: GaAs, InP, and LiNbO₃ substrates in filters, modulators, and high-frequency ICs. Medical and Life Sciences: Optical-quality wafers in imaging systems and bio-compatible substrates for diagnostic devices.

Quality & Inspection

Tinsan Materials maintains strict quality control protocols throughout the production and inspection processes:
Material Traceability: Full traceability from raw crystal to finished product. Dimensional Accuracy: Inspected using contact and non-contact metrology systems. Crystallographic Verification: XRD, Laue diffraction, or EBSD used to confirm orientation. Surface Integrity: Interferometry, AFM, and profilometry ensure specified flatness and roughness. Cleanroom Handling: Final inspection and packaging in Class 100 or better environments to minimize particle contamination. Reporting: COA, COC, and metrology reports available upon request.