Showing 25–36 of 75 results
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- High Thermal Conductivity: Up to 180 W/m·K, ideal for heat dissipation in electronic devices.
- Excellent Electrical Insulation: High resistivity, suitable for high-voltage applications.
- Low Thermal Expansion: Matches well with silicon, reducing thermal stress in electronic assemblies.
- Chemical Stability: Resistant to chemical corrosion, even at high temperatures.
- Wide Applicability: Compatible with a variety of processing methods, including sintering and powder metallurgy.
- Customizable Particle Sizes: Available in nano-scale and micro-scale particle sizes to meet specific requirements.
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- High Strength-to-Weight Ratio: Combines the lightweight nature of aluminum with the strength of niobium.
- Improved Thermal Stability: Suitable for high-temperature applications without significant degradation.
- Corrosion Resistance: Offers enhanced resistance to oxidation and wear in harsh environments.
- Versatile Processing: Compatible with various deposition techniques including thermal evaporation and sputtering.
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- Corrosion Resistance: Offers good resistance to oxidation and corrosion.
- Enhanced Strength: Combines the lightweight nature of aluminum with the strength of nickel.
- Magnetic Properties: Displays useful magnetic characteristics for specific applications.
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- Lightweight: Combines the lightweight nature of aluminum with the strength-enhancing effects of scandium.
- Improved Strength: Significantly increases yield strength and fatigue resistance.
- Corrosion Resistance: Offers good resistance to oxidation, making it suitable for harsh environments.
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- Excellent Electrical Conductivity: AlSi alloys offer good electrical conductivity, making them ideal for interconnect layers and conductive films in electronic devices.
- Thermal Stability: AlSi films exhibit high thermal stability, ensuring reliable performance in high-temperature environments, such as semiconductor processing.
- Prevention of Electromigration: The addition of silicon to aluminum helps mitigate electromigration, improving the longevity and reliability of electronic components.
- Corrosion Resistance: AlSi alloys have good resistance to oxidation and corrosion, contributing to the durability of thin films in harsh operating conditions.
- Lightweight and Strong: The lightweight nature of aluminum, combined with the added strength from silicon, makes AlSi alloys versatile in applications requiring both durability and reduced weight.
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$1.00 – $375.00
- Enhanced Strength: The addition of silicon increases tensile strength and hardness.
- Good Fluidity: Excellent flow properties make it suitable for casting and evaporation processes.
- Corrosion Resistance: Offers good resistance to oxidation and chemical exposure.
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- High Strength-to-Weight Ratio: AlSi10Mg powder delivers a high strength-to-weight ratio, making it suitable for lightweight but robust components.
- Excellent Corrosion Resistance: Offers superior resistance to corrosion, ideal for use in harsh environments.
- Good Castability: Provides excellent castability, ensuring high-quality results in additive manufacturing.
- Enhanced Thermal Conductivity: Offers good thermal conductivity, making it ideal for heat-dissipating applications.
- Low Shrinkage: Exhibits minimal shrinkage during the additive manufacturing process, ensuring high precision.
- Ease of Post-Processing: The material can be easily post-processed, including machining, anodizing, and surface treatment.
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- Electrical Conductivity: The presence of aluminum and copper in the alloy enhances the electrical conductivity of the deposited thin films, making it ideal for semiconductor and electronic applications.
- Thermal Stability: AlSiCu alloy films exhibit excellent thermal performance, ensuring stability in high-temperature environments like semiconductor fabrication and automotive electronics.
- Mechanical Strength: Silicon contributes to the mechanical durability of the alloy, providing resistance to wear and cracking in thin films, which is essential in demanding applications.
- Corrosion Resistance: The alloy offers good resistance to corrosion, ensuring longevity in exposed environments, such as automotive electronics and solar cells.
- Customizable Size and Shape: AlSiCu sputtering targets can be produced in various forms, including discs, plates, and custom shapes, to suit different PVD systems and specific requirements.
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- Improved Strength: Copper enhances the overall tensile strength and thermal stability.
- Excellent Conductivity: High electrical conductivity makes it suitable for electrical applications.
- Corrosion Resistance: Maintains performance under oxidative conditions.
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- Low Friction: Tin provides excellent lubricating properties, reducing wear on components.
- Corrosion Resistance: Offers good protection against oxidation and corrosion.
- Versatile: Suitable for a range of applications in electronics and machinery.
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- Excellent Surface Flatness: Atomically smooth surfaces after mechanical and chemical polishing
- Superior Purity: Available with purity grades ≥ 99.999% (5N) for high-precision applications
- Outstanding Thermal Conductivity: ~235 W/m·K at 300K
- High Ductility and Malleability: Ideal for deformation and recrystallization studies
- Stable Oxide Layer: Natural formation of a thin Al₂O₃ protective layer
- Corrosion Resistance: Suitable for atmospheric and mild chemical environments
- Customizable Size and Thickness: From small squares to large diameter disks
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- Ultra-High Thermal Conductivity: Up to 285 W/m·K, comparable to diamond.
- Wide Bandgap: ~6.2 eV, ideal for UV optoelectronic devices.
- High Electrical Resistivity: Excellent insulation properties.
- Superior Chemical and Thermal Stability: Suitable for harsh environments.
- Low Dielectric Constant and Loss: Enables high-frequency applications.
- High Mechanical Strength and Hardness: Durable under mechanical stress.
- Perfect Lattice Match for GaN: Supports high-quality epitaxial GaN growth.
